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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Lau, John;Fan, Xuejun • 2025

Science;Technology & Engineering | Science / Physics / Condensed Matter;Technology & Engineering / Chemical & Biochemical;Technology & Engineering / Electronics / Circuits / General;Technology & Engineering / Electronics / Semiconductors | Multi-Disciplinary

SubjectScience / Physics / Condensed Matter;Technology & Engineering / Chemical & Biochemical;Technology & Engineering / Electronics / Circuits / General;Technology & Engineering / Electronics / Semiconductors
ProgramGeneral
ProviderSpringer Nature
Access TypeOpen Access
ScopeNot indicated
Campus AvailabilityAll / Not specified
FormateBook
LicenseNot indicated
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Resource Metadata

Author / CreatorLau, John;Fan, Xuejun
Publisher / ProviderSpringer Nature
Resource TypeE-Book
Access TypeOpen Access
Subject AreaScience / Physics / Condensed Matter;Technology & Engineering / Chemical & Biochemical;Technology & Engineering / Electronics / Circuits / General;Technology & Engineering / Electronics / Semiconductors
FormateBook
LanguageEnglish
Publication Year2025
Copyright Year2025
ISBN / ISSN9.78982E+12
Date Added2026-08-04 00:15:18
Updated Date2026-08-04 00:25:03

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Lau, J. & Fan, X. (2025). Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. Publisher not indicated. https://portal.igpublish.com/iglibrary/search/SPNA0109195.html

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